Qualcomm is spitting out XR2 chips faster than VR headsets can use them

What you need to know

  • Qualcomm is allegedly sending new XR2 and XR2+ Gen 3 chips out to VR HMDs.
  • These “Project Matrix” chips supposedly support 16GB of RAM, UFS 4.0 storage, and 4K screens and may use Oryon CPUs.
  • The Snapdragon XR2+ Gen 2 was announced in early January and has yet to be featured in consumer products.

Qualcomm reportedly has begun testing and lending out its Snapdragon XR2 Gen 3 and XR2+ Gen 3 chips, designed for the next generation of VR headsets. This leaked news surprised us, given that one Gen 2 chip hasn’t entered consumers’ hands yet.

WinFuture’s Roland Quandt first posted on X about “Project Matrix,” the company’s “next-gen AR/VR chips,” on May 17. Specifically, he explained how the higher-end SXR2350 will support 16GB of RAM, UFS 4.0 storage, and 4K screens. 

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